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Value
Proposition
Linking optical and electronic systems typically means compromise. Integrating
fiber-optic systems with today's electronics has usually meant an awkward mix
of expensive, relatively large, mechanically complex systems that are difficult
to assemble and calibrate. More importantly, these devices usually don't match
well with the constantly shrinking electronic solutions of today.
The AXSUN™ Packaging Platform addresses this challenge with products
based on a series of technologies designed to reduce the size, and many of
the costs associated with today's optical solutions.
AXSUN's approach makes it technically and economically feasible to align any
combination of active and passive components within a single component-sized
footprint. The AXSUN™ Packaging Platform is the means by which diverse
collections of chips are arranged and joined on a single substrate using precise
free-space optical interconnections and micro-mechanical alignment structures.
And, many of these technologies are now available for use in other industries
as well.
AXSUN Technologies — We're delivering a new class of optoelectronic products
and technologies to integrate electronic systems with optical and mechanical
capabilities.
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AXSUN Technologies |
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