TECHNOLOGY   Agility defined. Innovation realized. To provide high-value opto-electronic subsystems and related capabilities, Axsun has pioneered a series of innovations and adapted best of breed technologies from premier research facilities. The result, the Axsun™ Packaging Platform, is uniquely capable of producing instrument quality, component-size, optical, opto-electronic, and micro-mechanical subsystems in high volumes, and with a minimum expenditure of labor. Among the technologies being developed by Axsun: Axsun's Optical Toolbox provides a complete suite of optical design elements and software to design miniature optical systems. The Optical Toolbox includes miniature versions of many of today's bulk optical elements and AXSUN's proprietary MEMs devices. To mount optical elements and other devices, Axsun invented a new class of micro-mechanical alignment structures that enable nanometer-precision optical alignment. The high aspect ratio metal LIGA technology we use for optical components is also used to fabricate miniature precision parts for other businesses. Axsun's automated module assembly system combines the features of high-precision passive placement along with epoxy-free joining for many components and subsystems, with an option for ultra-precise active alignment, enabling low loss coupling between optical elements. Today, the Axsun™ Packaging Platform allows Axsun to build miniaturized, reliable, opto-electronic instruments that can be mounted on existing circuit boards much like an LSI device. © Axsun Technologies